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Dual-layer plating thickness analysis with micro-spot XRF

Schematic of the analysis

Micro-XRF provides a versatile tool for fast analysis of NiP and Au dual-layer plating thickness on circuit boards without requiring sample preparation. The high spatial resolution capability of the XGT-9000 microscope enables characterisation of coatings on features with dimensions below 1 mm (and as small as 10 µm). In this note we show that 49 nm Au and 2.5 µm NiP layers are accurately and reproducibly measured with a 100 µm micro-spot.

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